StacksVerified U.S. regulatory reference

40 CFR Part 98, Table I-20

Verified against eCFR.gov as of June 20, 2026View official text on eCFR.gov
Process type/sub-typeProcess gas i
CF4C2 F6 | CHF3 | CH2 F2 | CH3 F | C3 F8 | C4 F8 | NF3 | SF6 | C4 F6 | C5 F8 | C4 F8 O

Etching/Wafer Cleaning

1-Ui0.680.80.350.150.340.30.160.170.280.170.1NA
BCF4NA0.210.0730.020.0380.210.0450.0350.00720.0340.11NA
BC2 F60.041NA0.040.00650.00640.180.030.0380.00170.0250.083NA
BC4 F60.0015NA0.0001NA0.001NA0.00083NANANANANA
BC4 F80.0051NA0.00061NA0.007NANANANANANANA
BC3 F8NANANANANANANANANANA0.00012NA
BC5 F8NANANANANANANANANANANANA
BCHF30.0056NANA0.0330.00490.0120.0290.00650.00120.0190.0069NA
BCH2 F20.014NA0.0026NA0.0023NA0.00140.000860.000020.00003NANA
BCH3 F0.00057NA0.12NANA0.00073NANA0.0082NANANA

Chamber Cleaning

In situ plasma cleaning

1-UiNANANANANANANA0.2NANANANA
BCF4NANANANANANANA0.037NANANANA
BC2 F6NANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANA

Remote plasma cleaning

1-UiNANANANANA0.063NA0.018NANANANA
BCF4NANANANANANANA0.038NANANANA
BC2 F6NANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANA
BCHF3NANANANANANANA0.000059NANANANA
BCH2 F2NANANANANANANA0.0016NANANANA
BCH3 FNANANANANANANA0.0028NANANANA

In situ thermal cleaning

1-UiNANANANANANANA0.28NANANANA
BCF4NANANANANANANA0.01NANANANA
BC2 F6NANANANANANANANANANANANA
BC3 F8NANANANANANANANANANANANA

[89 FR 31923, Apr. 25, 2024]